Starting in 2021, Intel renamed its chip fabrication technologies. Following are the new names. See
Intel microarchitectures and
SuperFin.
In production starting mid-2021
New Name Previously Features
Intel 7 Enhanced FinFET
SuperFin transistors
Intel 4 7nm EUV lithography
(see ultraviolet light)
Future Production
Intel 3 - 2H-2023 Denser,
Increased EUV
Intel 20A - 1H-2024 RibbonFET
transistors
PowerVia
interconnects
Intel 18A - (2025) Refined RibbonFET
20A = 20 angstroms (see angstrom)
18A = 18 angstroms (see angstrom)