(
Gate
All
Around
Field
Effect
Transistor) Emerging in the mid-2020s, GAAFET is the transistor technology following FinFET for high-end chips. In FinFET, the gate surrounds three sides of the channel between source and drain, but GAAFET gates surround all four sides for higher performance and better control. Pronounced "
gah-fet," when you view the GAAFET architecture below, there is no doubt the manufacturing process is more complicated.
However, gate architecture is only one part of transistor evolution. Other factors are the type of materials used, how transistors are wired together, how power is delivered and the lithographic methods used (see
EUV light). Chip packaging is also an important part of chip evolution (see
chip package).
Planar -> FinFET -> GAAFET -> CFET
In the first planar transistors, the gate resided over the channel between source and drain. FinFET gates wrap around three sides, but GAAFET gates completely surround the channel. The nanowire variety is yet to be commercialized. In time, CFETs are expected to replace GAAFETs (see
CFET). See
nanosheet.
(Top image courtesy of Intel.)