A chip manufacturing technique that creates features smaller than conventional lithography can achieve. There are various approaches; however, the basic directed self-assembly (DSA) method uses conventional lithography on the wafer to create a pattern of regions that act as a guide. A thin layer of block copolymer (BCP) molecules, comprising chemically different materials that repel each other, is then coated on top, and using heat or solvent, the copolymer aligns with the guides. See
chip manufacturing.