A machine designed to create bare dies (chiplets) for multichip modules the size of a grain of sand (see
MCM). A wafer is cut into tens of thousands of chiplets rather than hundreds as in the traditional semiconductor process. Following are two examples. See
chip manufacturing and
wafer.
Alien's FSA
In the 2010s, the tiny chips in Alien's Fluid Self Assembly (FSA) were named "Nanoblocks." The patented FSA technique floats the tiny Nanoblocks over a substrate with receptor wells, and the chiplets drop in.
PARC and DARPA
In 2013, a joint project of the Palo Alto Research Center (PARC) and DARPA was created for PARC's Xerographic micro-assembly chiplet printer. See
PARC.