(
Land
Grid
Array) A chip package with a very high density of contacts. LGAs differ from traditional chips with protruding pins that are inserted into a socket. An LGA chip has flat pads on the bottom of its package that touch contacts on the motherboard socket.
A Core i7 Chip
This Intel Core i7 chip uses an LGA package with 1,366 contacts, providing a very high density of pathways to the motherboard. Notice that the chip package contains pads rather than pins. (Image courtesy of Intel Corporation.)